Country for PR: Japan
Contributor: Kyodo News JBN
Thursday, March 22 2018 - 16:00
AsiaNet
Polyplastics Introduces New Series of Low-Dielectric LAPEROS (R) LCPs for Next-Generation Communication Devices
TOKYO, Mar. 22, 2018 /Kyodo JBN-- AsiaNet/ --

Polyplastics Co., Ltd., a leading global supplier of engineering 
thermoplastics, has announced the launch of a new series of low-dielectric 
liquid crystal polymers (LCPs) for next-generation communication devices. 
LAPEROS (R) E420P is the first in a series of low-dielectric grades which also 
possess inherent high heat resistance, mechanical properties, chemical 
resistance, high flow, and low warpage for films and connectors in cabling, 
antennas and circuit boards.

(Logo: https://kyodonewsprwire.jp/img/201803121805-O1-9BHl0BJ7)

(Image: Narrow-pitch connectors
https://kyodonewsprwire.jp/img/201803121805-O2-7u0M9Z3K)

Polyplastics developed the new LCP series amidst increasing demand for 
low-dielectric and low-dielectric-tangent materials to satisfy the needs of 5G 
telecommunications and V2X telecommunications for autonomous automobiles and 
materials applicable for high-speed and high-frequency transmission components.

LAPEROS (R) E420P makes use of an optimum combination of filler and formulation 
technology to achieve a low-dielectric constant of less than 3.0 measured 
perpendicular to the flow direction for the 1-20 GHz frequency band. Further, 
the dielectric loss tangent is stable over the entire frequency band. The 
material also fulfills downsizing requirements and increasingly complex designs 
in connector applications and can be used in surface-mount technology (SMT) 
processes.

Polyplastics will expand its series of low-dielectric LCPs to meet broader 
performance requirements for connectors. The company plans to extend its 
product portfolio to include grades with enhanced low warpage, higher heat 
resistance and greater flow for compact, fine-pitched connectors. Since 
connectors are the primary target application, these grades are formulated with 
good flowability. Polyplastics reports that in tests using the company's 
connector molds, the new grades are molded at lower packing pressure than 
conventional grades.

For more information, visit
https://www.polyplastics.com/en/product/lines/lcp_e420p/index.vm

LAPEROS (R) is a registered trademark of Polyplastics Co., Ltd. in Japan and 
other countries.

About Polyplastics
Polyplastics Co., Ltd. is a global leader in the development and production of 
engineering thermoplastic solutions. The company's broad product portfolio 
includes polyoxymethylene (POM), polybutylene terephthalate (PBT), 
polyphenylene sulfide (PPS), and LCPs. The company has the largest global 
market share of POM and LCPs. With more than 50 years of experience, the 
company is backed by a strong global network of R&D, production and sales 
resources capable of creating advanced solutions for an ever-changing global 
marketplace.


SOURCE: Polyplastics Co., Ltd.