Country for PR: United Kingdom
Contributor: PR Newswire Europe
Wednesday, November 16 2022 - 18:00
AsiaNet
ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330
MUNICH, Nov. 16, 2022 /PRNewswire-AsiaNet/-

ERS electronic (https://www.ers-gmbh.com/ ), the industry leader in thermal 
management solutions for semiconductor manufacturing, upgrades its Warpage 
Adjustment Tool 
(https://www.ers-gmbh.com/fan-out-equipment/warpage-adjustment/wat ) (WAT330), 
to include powerful capabilities for warpage measurement and correction.

WAT330: “ERS electronic’s Next-Generation Warpage Adjustment Tool is available 
to order now.”
WAT330: “ERS electronic’s Next-Generation Warpage Adjustment Tool is available 
to order now.”
Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced 
Packaging technologies. However, wafer deformity, also called "warpage" remains 
a common issue. As the technology continues to be adopted by OSATs and has 
transitioned from research to high-volume manufacturing, understanding and 
handling warpage is crucial to avoid machine downtime and low yield.

"For FoWLP, one of the major challenges is warpage within the process flow. In 
our models and tests we observed significant impact from material behavior, 
layout, geometry and loading history," says Dr. Olaf Wittler, head of the team 
Technology Characterization & Reliability Simulation at Fraunhofer IZM. 
"Therefore, solutions and strategies to control these influence factors for a 
low warpage are crucial to solve the challenge."

ERS has almost 15 years of experience in adjusting warpage of molded wafers in 
Fan-out. The company is recognized industry-wide for its patented AirCushion 
technology and TriTemp slide for contactless transport and warpage output of <1 
mm. They can both be found in most of ERS's machines and are typically applied 
for warpage correction after thermal debonding. However, with the WAT330, 
companies can address the issue of warpage regardless of where it occurs.

"Warpage is a top concern in high volume production and will remain so as the 
structure of FO becomes more complex," says Debbie-Claire Sanchez, FO Equipment 
Business Unit manager at ERS electronic. "We therefore extend our warpage 
correction capabilities to a standalone machine, which can be deployed 
in-between processes to aid manufacturing."

The upgraded WAT330 comes with a HEPA filter system for cleanroom class 100. It 
is also fully compliant with the GEM300 SEMI standards and compatible with 
automated product loading and unloading. Another noteworthy upgrade is the 
machine's Nitrogen environment, which can reach down to 0.5% O2 level to avoid 
Cu oxidation. The new WAT330 also features strong vacuum thermal chucks for 
no-fail wafer handling.

The machine is available to order now.

About ERS:

ERS electronic GmbH has gained an outstanding reputation in the semiconductor 
industry with its fast and accurate air cool-based thermal chuck systems for 
wafer probing and its thermal debonding and warpage adjustment tools for 
FOWLP/PLP.

www.ers-gmbh.com

Photo: https://mma.prnewswire.com/media/1948332/WAT330_machine.jpg
Logo: https://mma.prnewswire.com/media/1801970/ERS_electronic_GmbH_Logo.jpg

Source: ERS electronic GmbH
Translations

Japanese