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Contributor: PR Newswire Asia (Hong Kong)
Friday, December 02 2022 - 01:47
AsiaNet
DFI Empowers Edge AI Deployment with EC70A-TGU Compact Fanless System
TAIPEI, Dec. 1, 2022 /PRNewswire-AsiaNet/ --

DFI(http://www.dfi.com/?ad=media_1129-prnewswire_global&edm=media_1129-prnewswir
e_global), the leading global provider of embedded solutions and Edge AI 
computing technology across multiple industries, is releasing the new Edge AI 
inference computer 
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global).

EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) is powered by Intel® 11th Gen Tiger Lake 
Core™ processors, with 8GB onboard memory in a compact platform. Equipped with 
an all-new GPU in Iris® Xe embedded graphics, 
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) delivers disruptive GPU graphics performance 
and enables faster processing of images and video streams. Users can leverage 
the GPU to power cutting-edge AI solutions for various applications, including 
Industrial Automation, AMR/AGV, Smart Transportation, Medical Imaging, etc.

Maintaining the small size of the previous generation fanless embedded system, 
the 
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) is equipped with a compact fanless design, 
measuring only 181.6mm x 57mm x 118.4mm, while providing significantly upgraded 
performance. In addition, 
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) supports multiple I/Os, outperforming its 
counterparts with up to 6 USB 3.1 ports, and can be connected to more sensors 
and devices.

The 
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) also supports a wide temperature range of 
-20°C to 60°C and fanless design without performance compromising, meeting the 
harsh operating environment for factory automation and smart city applications. 
The system also includes onboard memory with vibration resistance to reduce the 
impact caused by movement.

DFI(http://www.dfi.com/?ad=media_1129-prnewswire_global&edm=media_1129-prnewswir
e_global) utilized the advantages of our advanced R&D design, continuing to 
optimize applications for developing a dedicated embedded system. The 
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) will help to accelerate the overall 
production efficiency, improve accuracy and achieve a zero-error production 
line, scaling up the performance of smart factories and intelligent warehouse 
applications.

Key Features:
- Intel® 11th Generation Tiger Lake Core™ i7/i5/i3 processors
- 8GB onboard memory and 1 SO-DIMM DDR4
- Supports up to 4 LAN or 6 USB (by SKU)
- Triple displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz)
- Supports wide temperature operation: -20°C~60°C
- Support M.2 B key 3042/3052 5G-NR module
- Supports up to 15 years of product lifecycle

Focus Applications:
- Factory automation
- Mobile Robotics (AMR) / Automated Guided Vehicles (AGV)
- Machine Vision
- Medical Imaging

About DFI

Founded in 1981, DFI is among the top 3 IPC providers of high-performance 
computing technology across multiple embedded industries. DFI's 
industrial-grade solutions enable customers to optimize their equipment and 
ensure high reliability, long-term life cycle, and 24/7 durability in various 
markets, including Industrial Automation, Medical, Gaming, Transportation, 
Energy, Mission-Critical, and Retail. Find out more at http://www.dfi.com/.

CONTACT: DFI MARCOM, dfimarcom@dfi.com, 886-2-2697-2986

Source: DFI Inc.

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