Country for PR: United States
Contributor: PR Newswire New York
Wednesday, December 21 2022 - 08:27
PEZY Computing Selects proteanTecs to Monitor Die-to-Die Interconnects in Next-Generation Supercomputer Processors
HAIFA, Israel, Dec. 21, 2022 /PRNewswire-AsiaNet/ --

-- Partnership solidifies proteanTecs' commitment to supporting Japan's high 
performance computing industry and the global 2.5D and 3D advanced packaging 

proteanTecs, a global leader of deep data analytics for advanced electronics, 
announced today that PEZY Computing has selected the company's 2.5D 
interconnect monitoring solution for interface validation, quality assurance 
and reliability monitoring. PEZY, a Japanese semiconductor manufacturer of 
advanced supercomputer processors, will use proteanTecs' solution to monitor 
the die-to-die (D2D) connectivity in their next-generation processors.

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High-performance computing (HPC) applications are a main driver pushing the 
semiconductor industry to adopt chiplet architectures and advanced packaging in 
order to scale in a "More than Moore" era. However, heterogeneous systems have 
thousands of potential failure points and limited visibility, where the weakest 
link causes a full system failure.

To address this emerging industry need, the proteanTecs high-resolution 
interconnect monitoring solution supports visibility at every stage—from 
characterization and qualification, assembly and test, to field deployment and 
operation. Unlike traditional approaches—which rely on low-granularity, 
pass-fail testing—this market-leading, patented solution delivers parametric 
lane grading with 100-percent lane and pin coverage, at test and in 

"proteanTecs' solution enhances processors with unparalleled visibility," said 
Kei Ishii, VP Processor Engineering at PEZY Computing. "Their deep data 
expedites system bring-up, characterization and testing, but it also benefits 
end customers who can leverage this technology in the field. In uptime-critical 
HPC and supercomputing environments, this solution is a gamechanger, allowing 
for performance monitoring and time-to-failure prediction."

"PEZY's revolutionary supercomputer processors are on the leading edge of high 
performance computing and deliver world-class energy efficiency," said Keith 
Morton, CRO at proteanTecs. "As a proven leader in the supercomputing industry, 
we welcome PEZY to our customer list."

PEZY uses the Global Unichip Corporation (GUC) High Bandwidth Memory Gen 3 
(HBM3) PHY, a silicon-proven solution that integrates the proteanTecs D2D 
interconnect monitoring technology.

About PEZY Computing

PEZY Computing is a fabless semiconductor manufacturer of leading-edge 
supercomputer chips. Using proprietary manycore processor technology, PEZY's 
advanced processors empower supercomputing systems to achieve top computing 
performance and to deliver world-class energy efficiency. Featured on the 
prestigious TOP500 and GREEN500 lists, PEZY's revolutionary solutions enable 
new applications that have positively impacted society, such as the world's 
fastest and most accurate human genome analysis. Founded in 2010, the company 
is headquartered in Tokyo, Japan. For more information, visit   

About proteanTecs 

proteanTecs is the leading provider of deep data analytics for advanced 
electronics monitoring. Trusted by global leaders in the datacenter, 
automotive, communications and mobile markets, the company provides system 
health and performance monitoring, from production to the field. By applying 
machine learning to novel data created by on-chip monitors, the company's deep 
data analytics solutions deliver unparalleled visibility and actionable 
insights—leading to new levels of quality and reliability. Founded in 2017 and 
backed by world-leading investors, the company is headquartered in Israel and 
has offices in the United States, India and Taiwan. For more information, visit  

SOURCE  proteanTecs

Contact: Elizabeth Brown, Media Relations,, +1